SARA / Free Tools / CVE / CVE-2017-18157

CVE-2017-18157 — A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile,

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20

CVSS

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EPSS

0.09% (top 74.70%)

CWE

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Published

2019-05-06T22:31:47.000Z

Last modified

2024-08-05T21:13:48.623Z

CVSS vector

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01What is this vulnerability?

02Affected products

Vendor	Product	Versions
Qualcomm Technologies, Inc.	Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear	MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20

03Active exploitation status

Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.

04Recommended remediation

Patch to a fixed version listed in the vendor advisory (see references below).
Mitigate with WAF rules, network egress filters, or feature flags where the patch is not yet available.
Hunt historical logs for exploitation indicators — see Detection signatures below.

05Technical details

For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.

06Detection signatures

Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.

07Related CVEs

No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.

08Timeline

Published: 2019-05-06T22:31:47.000Z
Last modified: 2024-08-05T21:13:48.623Z

09References

www.qualcomm.com — https://www.qualcomm.com/company/product-security/bulletins

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