Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile | SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 |
Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.
For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.
Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.
No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.