CVE-2022-33217 — Memory corruption in Qualcomm IPC due to buffer copy without checking the size o

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

01What is this vulnerability?

Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

02Affected products

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon Mobile	SD 8 Gen1 5G, WCD9380, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8835

03Active exploitation status

Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.

04Recommended remediation

• Patch to a fixed version listed in the vendor advisory (see references below).
• Mitigate with WAF rules, network egress filters, or feature flags where the patch is not yet available.
• Hunt historical logs for exploitation indicators — see Detection signatures below.

05Technical details

For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.

06Detection signatures

Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.

07Related CVEs

No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.

08Timeline

• Published: 2022-10-17T00:00:00.000Z
• Last modified: 2025-05-14T15:15:23.165Z

09References

• www.qualcomm.com — https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulleti…