SARA / Free Tools / CVE / CVE-2023-21639

CVE-2023-21639 — Memory corruption in Audio while processing sva_model_serializer using memory si

Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.

CVSS

6.7 MEDIUM

EPSS

0.03% (top 92.00%)

CWE

CWE-120

Published

2023-07-04T04:46:35.233Z

Last modified

2024-08-02T09:44:01.890Z

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

01What is this vulnerability?

Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client.

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	AQT1000, FastConnect 6200, QCA6420, QCA6430, SA4150P, SA4155P, SA6155P, SA8155P, SA8195P, SD855, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon W5+ Gen 1 Wearable Platform, SW5100, SW5100P, WCD9341, WCN3980, WCN3988, WSA8810, WSA8815, WSA8830, WSA8835

Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.

Patch to a fixed version listed in the vendor advisory (see references below).
Mitigate with WAF rules, network egress filters, or feature flags where the patch is not yet available.
Hunt historical logs for exploitation indicators — see Detection signatures below.

For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.

Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.

No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.

www.qualcomm.com — https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin

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