SARA / Free Tools / CVE / CVE-2023-21671

CVE-2023-21671 — Memory Corruption in Core during syscall for Sectools Fuse comparison feature

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

CVSS

9.3 CRITICAL

EPSS

0.06% (top 81.10%)

CWE

CWE-20

Published

2023-11-07T05:26:28.659Z

Last modified

2025-02-27T20:34:18.988Z

CVSS vector

CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H

01What is this vulnerability?

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	FastConnect 6700, FastConnect 6900, QCA6391, QCM6490, QCS6490, QSM8350, Qualcomm Video Collaboration VC3 Platform, SD888, SM7315, SM7325P, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), WCD9370, WCD9375, WCD9380, WCD9385, WCN6740, WSA8830, WSA8835

Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.

Patch to a fixed version listed in the vendor advisory (see references below).
Mitigate with WAF rules, network egress filters, or feature flags where the patch is not yet available.
Hunt historical logs for exploitation indicators — see Detection signatures below.

For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.

Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.

No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.

www.qualcomm.com — https://www.qualcomm.com/company/product-security/bulletins/november-2023-bullet…

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