CVE-2023-33092 — Memory corruption while processing pin reply in Bluetooth, when pin code receive

Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.

01What is this vulnerability?

Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.

02Affected products

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	AQT1000, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, FastConnect 7800, QCA6310, QCA6320, QCA6391, QCA6420, QCA6430, QCM4325, QCM4490, QCM5430, QCM6490, QCM8550, QCS4490, QCS5430, QCS6490, QCS7230, QCS8250, QCS8550, Qualcomm 215 Mobile Platform, Qualcomm Video Collaboration VC3 Platform, Qualcomm Video Collaboration VC5 Platform, SD730, SD835, SD855, SD888, SG4150P, SM6250, SM7250P, SM7315, SM7325P, SM8550P, Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 4 Gen 2 Mobile Platform, Snapdragon 460 Mobile Platform, Snapdragon 480 5G Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 662 Mobile Platform, Snapdragon 680 4G Mobile Platform, Snapdragon 685 4G Mobile Platform (SM6225-AD), Snapdragon 690 5G Mobile Platform, Snapdragon 695 5G Mobile Platform, Snapdragon 720G Mobile Platform, Snapdragon 730 Mobile Platform (SM7150-AA), Snapdragon 730G Mobile Platform (SM7150-AB), Snapdragon 732G Mobile Platform (SM7150-AC), Snapdragon 765 5G Mobile Platform (SM7250-AA), Snapdragon 765G 5G Mobile Platform (SM7250-AB), Snapdragon 768G 5G Mobile Platform (SM7250-AC), Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, Snapdragon 835 Mobile PC Platform, Snapdragon 855 Mobile Platform, Snapdragon 855+/860 Mobile Platform (SM8150-AC), Snapdragon 865 5G Mobile Platform, Snapdragon 865+ 5G Mobile Platform (SM8250-AB), Snapdragon 870 5G Mobile Platform (SM8250-AC), Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon X55 5G Modem-RF System, WCD9326, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCD9390, WCD9395, WCN3615, WCN3660B, WCN3680B, WCN3950, WCN3980, WCN3988, WCN3990, WCN6740, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835, WSA8840, WSA8845, WSA8845H

03Active exploitation status

Not currently listed on the CISA Known Exploited Vulnerabilities (KEV) catalog. EPSS is the best forward-looking signal — see the EPSS row above.

04Recommended remediation

• Patch to a fixed version listed in the vendor advisory (see references below).
• Mitigate with WAF rules, network egress filters, or feature flags where the patch is not yet available.
• Hunt historical logs for exploitation indicators — see Detection signatures below.

05Technical details

For the full vendor write-up, exploit chains, and reference implementations, see the references list in section 09.

06Detection signatures

Ask SARA in chat to draft a starting detection for this CVE in your stack of choice.

07Related CVEs

No directly-cited follow-up CVEs in the KB record for this advisory. The references list in section 09 carries the vendor cross-references.

08Timeline

• Published: 2023-12-05T03:04:24.232Z
• Last modified: 2025-05-29T13:30:41.840Z

09References

• www.qualcomm.com — https://www.qualcomm.com/company/product-security/bulletins/december-2023-bullet…